1. PROTEL 99 SE
2. GERBER FILE (RS-274X, RS-274D)
3. AUTOCAD FILE
4. ALTIUM DESIGNER (.PCBDOC)
5. OTHER ELECTRONIC CONVERTIBLE FILE
* Uncommon materials upon request
Single Sided PCB |
|||||
|---|---|---|---|---|---|
| Type | Copper Thickness | CCL Thicknesses (mm.) | |||
| 0.8 | 1.0 | 1.2 | 1.6 | ||
| FR-1 | 1/0 Oz. (35 μm.) |  |
|
|
|
| CEM-1 | 1/0 Oz. (35 μm.) | * | * | * | |
| CEM-3 | 1/0 Oz. (35 μm.) | |
* | * | |
| FR-4 | 1/0 Oz. (35 μm.) | * | * | |
|
| Aluminum 5052 (2W/mk.) | 1/0 Oz. (35 μm.) | * | * | |
|
Double Sided PCB |
|||||
|---|---|---|---|---|---|
| Type | Copper Thickness | CCL Thicknesses (mm.) | |||
| 0.8 | 1.0 | 1.2 | 1.6 | ||
| FR-4 (Tg140) | H/H Oz. (18/18 μm.) | |
|
|
|
| 1/1 Oz. (35/35 μm.) | |
|
* | |
|
Special Materials For RF Application |
|||||
| Type | Copper Thickness | Resin System | CCL Thicknesses(mm.) | Remarks | |
| Rogers Corporation (RO4533) | 1/1 Oz. (35/35 μm.) | Ceramic Filled | 0.8 | Low profile copper for improved PIM | Taconic (TLX-7) | 1/1 Oz. (35/35 μm.) | PTFE | 0.8 | Low profile copper for improved PIM |
Multilayers PCB (Tg140) |
|||||
|---|---|---|---|---|---|
| Copper Thickness | CCL Thicknesses | ||||
| Inner Layer | 1/1 Oz. (35/35 μm.) |
|
|||
| Copper Thickness | |||||
| Outer Layer Base Copper | 1/2 Oz. (18 μm.) | 1 Oz. (35 μm.) | 2 Oz. (70 μm.) | ||
| Fiber Glass Style | After Pressed Thickness/sheet | ||||
| Standard Prepreg | #7628 | 190 +/- 10 μm. | |||
| #1080 | 70 +/- 8 μm. | ||||
Types of Surface Finishing |
||
|---|---|---|
| OSP (Organic Solderability Preservative) |
HASL Lead-Free (Hot Air Solder Leveling Lead-Free) |
ENIG (Electroless Nickel Immersion Gold) |
Subject |
Small Volume |
Mass Volume |
Remarks |
| Max. Layer Count | 10 Layers | 10 Layers | Through hole type only. For HDI sequential lamination Max. 6 Layer |
| PTH Aspect Ratio | 10 : 1 | 8 : 1 | Material Thickness : Drill diameter |
| Min. Drill Size | 0.15 mm | 0.2 mm | - |
| Min. Board Thickness (Final) | 0.8 mm | 0.8 mm | - |
| Max. Board Thickness (Final) | 3.0 mm | 3.0 mm | FR-4 Multilayer only |
| Min. Prepreg Thickness | 0.075 mm | 0.075 mm | - |
| Min. Finished Copper Thickness | 1 OZ (35 μm.) | 1 OZ (35 μm.) | - |
| Inner Layer Max. Finished Copper Thickness | 2 OZ (70 μm.) | 2 OZ (70 μm.) | - |
| Outer Layer Max. Finished Copper Thickness | 3 OZ (105 μm.) | 3 OZ (105 μm.) | - |
| Min. Line Spacing (Inner Layer) | 0.1 mm (4 mil.) | 0.125 mm (5 mil.) | Higher Copper Thickness Requires Wider Line and Spaceing |
| Min. Line Spacing (Outer Layer) | 0.1 mm (4 mil.) | 0.125 mm (5 mil.) | - |
| Min. Annular Ring | 0.125 mm (5 mil.) | 0.125 mm (5 mil.) | - |
| Drill Accuracy (+/-) | 35 μm. | 35 μm. | - |
| Multilayer Layer Registration (+/-) | 35 μm. | 35 μm. | - |
| Solder Mark Registration (+/-) | 75 μm. | 75 μm. | - |
| Rout / Score Tolerances (+/-) | 0.2 mm | 0.2 mm | - |
| Blind Via | YES | YES | Mechanical Blind Via |
| Blind Via Aspect Ratio | 1:1 | 1:1 | Via Plug / Filled and Capped NOT AVAILABLE |
| Buried Via | YES | YES |
1. PROTEL 99 SE
2. GERBER FILE (RS-274X, RS-274D)
3. AUTOCAD FILE
4. ALTIUM DESIGNER (.PCBDOC)
5. OTHER ELECTRONIC CONVERTIBLE FILE
* Uncommon materials upon request
Single Sided PCB |
|||||
|---|---|---|---|---|---|
| Type | Copper Thickness | CCL Thicknesses (mm.) | |||
| 0.8 | 1.0 | 1.2 | 1.6 | ||
| FR-1 | 1/0 Oz. (35 μm.) | |
|
|
|
| CEM-1 | 1/0 Oz. (35 μm.) | * | * | * | |
| CEM-3 | 1/0 Oz. (35 μm.) | |
* | * | |
| FR-4 | 1/0 Oz. (35 μm.) | * | * | |
|
| Aluminum 5052 (2W/mk.) | 1/0 Oz. (35 μm.) | * | * | |
|
Double Sided PCB |
|||||
|---|---|---|---|---|---|
| Type | Copper Thickness | CCL Thicknesses (mm.) | |||
| 0.8 | 1.0 | 1.2 | 1.6 | ||
| FR-4 (Tg140) | H/H Oz. (18/18 μm.) | |
|
|
|
| 1/1 Oz. (35/35 μm.) | |
|
* | |
|
Special Materials For RF Application |
|||||
| Type | Copper Thickness | Resin System | CCL (mm.) | Remarks | |
| Rogers Corporation (RO4533) | 1/1 Oz. (35/35 μm.) | Ceramic Filled | 0.8 | Low profile copper for improved PIM | Taconic (TLX-7) | 1/1 Oz. (35/35 μm.) | PTFE | 0.8 | Low profile copper for improved PIM |
Multilayers PCB (Tg140) |
|||||
|---|---|---|---|---|---|
| Copper Thickness | CCL Thicknesses | ||||
| Inner Layer | 1/1 Oz. (35/35 μm.) |
|
|||
| Copper Thickness | |||||
| Outer Layer Base Copper | 1/2 Oz. (18 μm.) | 1 Oz. (35 μm.) | 2 Oz. (70 μm.) | ||
| Fiber Glass Style | After Pressed Thickness/sheet | ||||
| Standard Prepreg | #7628 | 190 +/- 10 μm. | |||
| #1080 | 70 +/- 8 μm. | ||||
Types of Surface Finishing |
||
|---|---|---|
| OSP (Organic Solderability Preservative) |
HASL Lead-Free (Hot Air Solder Leveling Lead-Free) |
ENIG (Electroless Nickel Immersion Gold) |
Subject |
Small Volume |
Mass Volume |
Remarks |
| Max. Layer Count | 10 Layers | 10 Layers | Through hole type only. For HDI sequential lamination Max. 6 Layer |
| PTH Aspect Ratio | 10 : 1 | 8 : 1 | Material Thickness : Drill diameter |
| Min. Drill Size | 0.15 mm | 0.2 mm | - |
| Min. Board Thickness (Final) | 0.8 mm | 0.8 mm | - |
| Max. Board Thickness (Final) | 3.0 mm | 3.0 mm | FR-4 Multilayer only |
| Min. Prepreg Thickness | 0.075 mm | 0.075 mm | - |
| Min. Finished Copper Thickness | 1 OZ (35 μm.) | 1 OZ (35 μm.) | - |
| Inner Layer Max. Finished Copper Thickness | 2 OZ (70 μm.) | 2 OZ (70 μm.) | - |
| Outer Layer Max. Finished Copper Thickness | 3 OZ (105 μm.) | 3 OZ (105 μm.) | - |
| Min. Line Spacing (Inner Layer) | 0.1 mm (4 mil.) | 0.125 mm (5 mil.) | Higher Copper Thickness Requires Wider Line and Spaceing |
| Min. Line Spacing (Outer Layer) | 0.1 mm (4 mil.) | 0.125 mm (5 mil.) | - |
| Min. Annular Ring | 0.125 mm (5 mil.) | 0.125 mm (5 mil.) | - |
| Drill Accuracy (+/-) | 35 μm. | 35 μm. | - |
| Multilayer Layer Registration (+/-) | 35 μm. | 35 μm. | - |
| Solder Mark Registration (+/-) | 75 μm. | 75 μm. | - |
| Rout / Score Tolerances (+/-) | 0.2 mm | 0.2 mm | - |
| Blind Via | YES | YES | Mechanical Blind Via |
| Blind Via Aspect Ratio | 1:1 | 1:1 | Via Plug / Filled and Capped NOT AVAILABLE |
| Buried Via | YES | YES |