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ขีดความสามารถในการผลิต

ประเภทไฟล์ออกแบบที่สามารถรับได้

1. PROTEL 99 SE

2. GERBER FILE (RS-274X, RS-274D)

3. AUTOCAD FILE

4. ALTIUM DESIGNER (.PCBDOC)

5. OTHER ELECTRONIC CONVERTIBLE FILE

วัตถุดิบ

* กรณีต้องการวัตถุดิบอื่น สามารถติดต่อสอบถามได้

Single Sided PCB
Type Copper Thickness CCL Thicknesses (mm.)
0.8 1.0 1.2 1.6
FR-1 1/0 Oz. (35 μm.)
CEM-1 1/0 Oz. (35 μm.) * * *
CEM-3 1/0 Oz. (35 μm.) * *
FR-4 1/0 Oz. (35 μm.) * *
Aluminium 5052 (2W/mk.) 1/0 Oz. (35 μm.) * *
Double Sided PCB
Type Copper Thickness CCL Thicknesses (mm.)
0.8 1.0 1.2 1.6
FR-4 (Tg140) H/H Oz. (18/18 μm.)
1/1 Oz. (35/35 μm.) *
Special Materials For RF Application
Type Copper Thickness Resin System CCL Thicknesses(mm.) Remarks
Rogers Corporation (RO4533) 1/1 Oz. (35/35 μm.) Ceramic Filled 0.8 Low profile copper for improved PIM
Taconic (TLX-7) 1/1 Oz. (35/35 μm.) PTFE 0.8 Low profile copper for improved PIM
Multilayers PCB (Tg140)
Copper Thickness CCL Thicknesses
Inner Layer 1/1 Oz. (35/35 μm.)
  • 0.1 mm.
  • 0.15 mm.
  • 0.26 mm.
  • 0.38 mm.
  • 1.00 mm.
Copper Thickness
Outer Layer Base Copper 1/2 Oz. (18 μm.) 1 Oz. (35 μm.) 2 Oz. (70 μm.)
Fiber Glass Style After Pressed Thickness/sheet
Standard Prepreg #7628 190 +/- 10 μm.
#1080 70 +/- 8 μm.
Types of Surface Finishing
OSP.
(Organic Solderability Preservative)
HASL Lead-Free
(Hot Air Solder Leveling Lead-Free)
ENIG
(Electroless Nickel Immersion Gold)

ขีดความสามารถในการผลิต

Subject
Small Volume
Mass Volume
Remarks
Max. Layer Count 10 Layers 10 Layers Through hole type only. For HDI sequential lamination Max. 6 Layer
PTH Aspect Ratio 10 : 1 8 : 1 Material Thickness : Drill diameter
Min. Drill Size 0.15 mm 0.2 mm -
Min. Board Thickness (Final) 0.8 mm 0.8 mm -
Max. Board Thickness (Final) 3.0 mm 3.0 mm FR-4 Multilayer only
Min. Prepreg Thickness 0.075 mm 0.075 mm -
Min. Finished Copper Thickness 1 OZ (35 μm.) 1 OZ (35 μm.) -
Inner Layer Max. Finished Copper Thickness 2 OZ (70 μm.) 2 OZ (70 μm.) -
Outer Layer Max. Finished Copper Thickness 3 OZ (70 μm.) 3 OZ (70 μm.) -
Min. Line Spacing (Inner Layer) 0.1 mm (4 mil.) 0.125 mm (5 mil.) Higher Copper Thickness Requires Wider Line and Spaceing
Min. Line Spacing (Outer Layer) 0.1 mm (4 mil.) 0.125 mm (5 mil.) -
Min. Annular Ring 0.125 mm (5 mil.) 0.125 mm (5 mil.) -
Drill Accuracy (+/-) 35 μm. 35 μm. -
Multilayer Layer Registration (+/-) 35 μm. 35 μm. -
Solder Mark Registration (+/-) 75 μm. 75 μm. -
Rout / Score Tolerances (+/-) 0.2 mm 0.2 mm -
Blind Via YES YES Mechanical Blind Via
Blind Via Aspect Ratio 1:1 1:1 Via Plug / Filled and Capped NOT AVAILABLE
Buried Via YES YES
ประเภทไฟล์ออกแบบที่สามารถรับได้

1. PROTEL 99 SE

2. GERBER FILE (RS-274X, RS-274D)

3. AUTOCAD FILE

4. ALTIUM DESIGNER (.PCBDOC)

5. OTHER ELECTRONIC CONVERTIBLE FILE

วัตถุดิบ

* กรณีต้องการวัตถุดิบอื่น สามารถติดต่อสอบถามได้

Single Sided PCB
Type Copper Thickness CCL Thicknesses (mm.)
0.8 1.0 1.2 1.6
FR-1 1/0 Oz. (35 μm.)
CEM-1 1/0 Oz. (35 μm.) * * *
CEM-3 1/0 Oz. (35 μm.) * *
FR-4 1/0 Oz. (35 μm.) * *
Aluminium 5052 (2W/mk.) 1/0 Oz. (35 μm.) * *
Double Sided PCB
Type Copper Thickness CCL Thicknesses (mm.)
0.8 1.0 1.2 1.6
FR-4 (Tg140) H/H Oz. (18/18 μm.)
1/1 Oz. (35/35 μm.) *
Special Materials For RF Application
Type Copper Thickness Resin System CCL (mm.) Remarks
Rogers Corporation (RO4533) 1/1 Oz. (35/35 μm.) Ceramic Filled 0.8 Low profile copper for improved PIM
Taconic (TLX-7) 1/1 Oz. (35/35 μm.) PTFE 0.8 Low profile copper for improved PIM
Multilayers PCB (Tg140)
Copper Thickness CCL Thicknesses
Inner Layer 1/1 Oz. (35/35 μm.)
  • 0.1 mm.
  • 0.15 mm.
  • 0.26 mm.
  • 0.38 mm.
  • 1.00 mm.
Copper Thickness
Outer Layer Base Copper 1/2 Oz. (18 μm.) 1 Oz. (35 μm.) 2 Oz. (70 μm.)
Fiber Glass Style After Pressed Thickness/sheet
Standard Prepreg #7628 190 +/- 10 μm.
#1080 70 +/- 8 μm.
Types of Surface Finishing
OSP.
(Organic Solderability Preservative)
HASL Lead-Free
(Hot Air Solder Leveling Lead-Free)
ENIG
(Electroless Nickel Immersion Gold)
PIC PIC PIC
ขีดความสามารถในการผลิต
Subject
Small Volume
Mass Volume
Remarks
Max. Layer Count 10 Layers 10 Layers Through hole type only. For HDI sequential lamination Max. 6 Layer
PTH Aspect Ratio 10 : 1 8 : 1 Material Thickness : Drill diameter
Min. Drill Size 0.15 mm 0.2 mm -
Min. Board Thickness (Final) 0.8 mm 0.8 mm -
Max. Board Thickness (Final) 3.0 mm 3.0 mm FR-4 Multilayer only
Min. Prepreg Thickness 0.075 mm 0.075 mm -
Min. Finished Copper Thickness 1 OZ (35 μm.) 1 OZ (35 μm.) -
Inner Layer Max. Finished Copper Thickness 2 OZ (70 μm.) 2 OZ (70 μm.) -
Outer Layer Max. Finished Copper Thickness 3 OZ (70 μm.) 3 OZ (70 μm.) -
Min. Line Spacing (Inner Layer) 0.1 mm (4 mil.) 0.125 mm (5 mil.) Higher Copper Thickness Requires Wider Line and Spaceing
Min. Line Spacing (Outer Layer) 0.1 mm (4 mil.) 0.125 mm (5 mil.) -
Min. Annular Ring 0.125 mm (5 mil.) 0.125 mm (5 mil.) -
Drill Accuracy (+/-) 35 μm. 35 μm. -
Multilayer Layer Registration (+/-) 35 μm. 35 μm. -
Solder Mark Registration (+/-) 75 μm. 75 μm. -
Rout / Score Tolerances (+/-) 0.2 mm 0.2 mm -
Blind Via YES YES Mechanical Blind Via
Blind Via Aspect Ratio 1:1 1:1 Via Plug / Filled and Capped NOT AVAILABLE
Buried Via YES YES